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3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits.

P. Zhou, Y. Ma, Z. Li, R. Dick, L. Shang, H. Zhou, X. Hong, and Q. Zhou. ICCAD, page 590-597. IEEE Computer Society, (2007)

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Li Li

Other publications of authors with the same name

Transformers in Medical Image Analysis: A Review.K. He, C. Gan, Z. Li, I. Rekik, Z. Yin, W. Ji, Y. Gao, Q. Wang, J. Zhang, and D. Shen. CoRR, (2022)Learning to simulate partially known spatio-temporal dynamics with trainable difference operators.X. Huang, Z. Li, H. Liu, Z. Wang, H. Zhou, B. Dong, and B. Hua. CoRR, (2023)Offline and Online Optical Flow Enhancement for Deep Video Compression.C. Tang, X. Sheng, Z. Li, H. Zhang, L. Li, and D. Liu. AAAI, page 5118-5126. AAAI Press, (2024)Micro-architecture Pipelining Optimization with Throughput-Aware Floorplanning.Y. Ma, Z. Li, J. Cong, X. Hong, G. Reinman, S. Dong, and Q. Zhou. ASP-DAC, page 920-925. IEEE Computer Society, (2007)Unified Quadratic Programming Approach For 3-D Mixed Mode Placement.H. Yan, Z. Li, X. Hong, and Q. Zhou. ISCAS, page 3411-3414. IEEE, (2007)A divide-and-conquer 2.5-D floorplanning algorithm based on statistical wirelength estimation.Z. Li, X. Hong, Q. Zhou, Y. Cai, J. Bian, H. Yang, P. Saxena, and V. Pitchumani. ISCAS (6), page 6230-6233. IEEE, (2005)Integrating dynamic thermal via planning with 3D floorplanning algorithm.Z. Li, X. Hong, Q. Zhou, S. Zeng, J. Bian, H. Yang, V. Pitchumani, and C. Cheng. ISPD, page 178-185. ACM, (2006)Hierarchical 3-D Floorplanning Algorithm for Wirelength Optimization.Z. Li, X. Hong, Q. Zhou, Y. Cai, J. Bian, H. Yang, V. Pitchumani, and C. Cheng. IEEE Trans. Circuits Syst. I Regul. Pap., 53-I (12): 2637-2646 (2006)Time-Series Neural Network: A High-Accuracy Time-Series Forecasting Method Based on Kernel Filter and Time Attention.L. Zhang, R. Wang, Z. Li, J. Li, Y. Ge, S. Wa, S. Huang, and C. Lv. Inf., 14 (9): 500 (2023)Detection of Jamming Attacks for the Physical-Layer Authentication.H. Tan, Z. Li, N. Xie, J. Lu, and D. Niyato. IEEE Trans. Wirel. Commun., 22 (12): 9579-9594 (December 2023)

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Disambiguation of "Li, Zhuoyuan"

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3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits.

Please choose a person to relate this publication to

Li Li

Li Li

Li Li

Li Li

Li Li

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Li, Zhuoyuan"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML 3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits.

Please choose a person to relate this publication to

Li Li

Li Li

Li Li

Li Li

Li Li

Other publications of authors with the same name

Disambiguation

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URL
DOI
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Chicago
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3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits.