( en | de | ru )

 

Disambiguation

From post

копироватьудалитьдобавить публикацию в буфер
Handling of multi-reflections in wafer bump 3D reconstruction.

, , , и . SMC, стр. 1558-1561. IEEE, (2008)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed.

M S Perzanowski

M S Khan

M S Jenny

Rahul M S

Kenneth M Dürsteler-MacFarland

 

Другие публикации лиц с тем же именем

Optimization of Bit-Pairing Codification with Learning for 3D Reconstruction., , , , и . Int. J. Image Graph., 7 (3): 445-462 (2007)Use of Paraplanar Constraint for Parallel Inspection of Wafer Bump Heights., , , и . IPCV, стр. 157-163. CSREA Press, (2007)Reference-Free Machine Vision Inspection of semiconductor die Images., , , , и . Int. J. Image Graph., 9 (1): 133-152 (2009)An edge-from-focus approach to 3D inspection and metrology., , , , , , и . Image Processing: Machine Vision Applications, том 9405 из SPIE Proceedings, стр. 94050E. SPIE, (2015)A polynomial phase-shift algorithm for high precision three-dimensional profilometry., , , , , и . Image Processing: Machine Vision Applications, том 8661 из SPIE Proceedings, стр. 866102. SPIE, (2013)A novel design of grating projecting system for 3D reconstruction of wafer bumps., , , , , , и . Three-Dimensional Image Capture and Applications, том 6056 из SPIE Proceedings, стр. 605601. SPIE, (2006)EC-EGI: enriched complex EGI for 3D shape registration., , и . Mach. Vis. Appl., 21 (2): 177-188 (2010)Handling of multi-reflections in wafer bump 3D reconstruction., , , и . SMC, стр. 1558-1561. IEEE, (2008)Bit-pairing Codification for Binary Pattern Projection System., , , и . ICPR (2), стр. 263-266. IEEE Computer Society, (2006)An elliptic phase-shift algorithm for high speed three-dimensional profilometry., , , , , и . Image Processing: Machine Vision Applications, том 8661 из SPIE Proceedings, стр. 86610S. SPIE, (2013)