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Use of Paraplanar Constraint for Parallel Inspection of Wafer Bump Heights., , , and . IPCV, page 157-163. CSREA Press, (2007)Optimization of Bit-Pairing Codification with Learning for 3D Reconstruction., , , , and . Int. J. Image Graph., 7 (3): 445-462 (2007)Reference-Free Machine Vision Inspection of semiconductor die Images., , , , and . Int. J. Image Graph., 9 (1): 133-152 (2009)An edge-from-focus approach to 3D inspection and metrology., , , , , , and . Image Processing: Machine Vision Applications, volume 9405 of SPIE Proceedings, page 94050E. SPIE, (2015)A polynomial phase-shift algorithm for high precision three-dimensional profilometry., , , , , and . Image Processing: Machine Vision Applications, volume 8661 of SPIE Proceedings, page 866102. SPIE, (2013)A novel design of grating projecting system for 3D reconstruction of wafer bumps., , , , , , and . Three-Dimensional Image Capture and Applications, volume 6056 of SPIE Proceedings, page 605601. SPIE, (2006)EC-EGI: enriched complex EGI for 3D shape registration., , and . Mach. Vis. Appl., 21 (2): 177-188 (2010)Handling of multi-reflections in wafer bump 3D reconstruction., , , and . SMC, page 1558-1561. IEEE, (2008)Bit-pairing Codification for Binary Pattern Projection System., , , and . ICPR (2), page 263-266. IEEE Computer Society, (2006)An elliptic phase-shift algorithm for high speed three-dimensional profilometry., , , , , and . Image Processing: Machine Vision Applications, volume 8661 of SPIE Proceedings, page 86610S. SPIE, (2013)