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Three-Dimensional 128 Gb MLC Vertical nand Flash Memory With 24-WL Stacked Layers and 50 MB/s High-Speed Programming.

, , , , , , , , , , , , , , , , , , , , , , , , , , , , , and . IEEE J. Solid State Circuits, 50 (1): 204-213 (2015)

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Time-triggered and message-triggered object framework and global time-based synchronization for real-time multimedia streaming., , , and . Comput. Syst. Sci. Eng., (2007)Experimental Evaluation of a Hybrid Approach for Deriving Service-Time Bounds of Methods in Real-Time Distributed Computing Objects., , and . IESS, volume 310 of IFIP Advances in Information and Communication Technology, page 139-148. Springer, (2009)Simulation of Retention Characteristics in Double-Gate Structure Multi-Bit SONOS Flash Memory., , , , , and . IEICE Trans. Electron., 92-C (5): 659-663 (2009)Experimental Feasibility Evaluations of Heuristic Multi-Layering Schemes for QoS Adaptive MPEG-4 Video Streaming., and . MIPS, volume 3311 of Lecture Notes in Computer Science, page 153-164. Springer, (2004)Scalable MPEG-4 Storage Framework with Low Bit-Rate Meta-information., and . PDCAT, volume 3320 of Lecture Notes in Computer Science, page 420-423. Springer, (2004)A 512-Gb 3-b/Cell 64-Stacked WL 3-D-NAND Flash Memory., , , , , , , , , and 20 other author(s). IEEE J. Solid State Circuits, 53 (1): 124-133 (2018)Time-Triggered and Message-Triggered Object Architecture for Distributed Real-Time Multimedia Services., , and . PCM (2), volume 3332 of Lecture Notes in Computer Science, page 330-337. Springer, (2004)Experimental Reliability Analysis of Multi-UAV Simulation with TMO-Based Distributed Architecture and Global Time Synchronization., , and . ISORC Workshops, page 211-218. IEEE Computer Society, (2010)19.5 Three-dimensional 128Gb MLC vertical NAND Flash-memory with 24-WL stacked layers and 50MB/s high-speed programming., , , , , , , , , and 35 other author(s). ISSCC, page 334-335. IEEE, (2014)A 1 Tb 4b/cell 5th-Generation 3D-NAND Flash Memory with 2ms tPROG, 110us tR and 1.2Gb/s/pin Interface.. IMW, page 1-4. IEEE, (2021)