%0 Conference Paper %1 conf/irps/LeeLLKJLHKP23 %A Lee, S. %A Lee, N.-H. %A Lee, K. W. %A Kim, J. H. %A Jin, J. H. %A Lee, Y. S. %A Hwang, Y. C. %A Kim, H. S. %A Pae, S. %B IRPS %D 2023 %I IEEE %K dblp %P 1-4 %T Development and Product Reliability Characterization of Advanced High Speed 14nm DDR5 DRAM with On-die ECC. %U http://dblp.uni-trier.de/db/conf/irps/irps2023.html#LeeLLKJLHKP23 %@ 978-1-6654-5672-2

@inproceedings{conf/irps/LeeLLKJLHKP23, added-at = {2023-05-24T00:00:00.000+0200}, author = {Lee, S. and Lee, N.-H. and Lee, K. W. and Kim, J. H. and Jin, J. H. and Lee, Y. S. and Hwang, Y. C. and Kim, H. S. and Pae, S.}, biburl = {https://www.bibsonomy.org/bibtex/2c466b0678a02ac6657efebc0bbcbcd41/dblp}, booktitle = {IRPS}, crossref = {conf/irps/2023}, ee = {https://doi.org/10.1109/IRPS48203.2023.10117889}, interhash = {fc36106cf9c48cfd6ea9f0422b43c7eb}, intrahash = {c466b0678a02ac6657efebc0bbcbcd41}, isbn = {978-1-6654-5672-2}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2024-04-09T12:18:52.000+0200}, title = {Development and Product Reliability Characterization of Advanced High Speed 14nm DDR5 DRAM with On-die ECC.}, url = {http://dblp.uni-trier.de/db/conf/irps/irps2023.html#LeeLLKJLHKP23}, year = 2023 }