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Disambiguation of "Kikuchi, Katsuya"

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Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit.

, , , , , , and . Microelectron. J., 46 (12): 1106-1113 (2015)

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Tomoo Kikuchi

 

Other publications of authors with the same name

Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits., , , , , and . Microelectron. Reliab., (2017)Thermal Stress Comparison of Annular-Trench-Isolated (ATI) TSV with Cu and Solder Core., , , , and . 3DIC, page 1-4. IEEE, (2019)Substrate monitoring system for inspecting defects in TSV-based data buses., , and . 3DIC, page 1-5. IEEE, (2014)Ultrawideband ultralow PDN impedance of decoupling capacitor embedded interposers using narrow gap chip parts mounting technology for 3-D integrated LSI system., , , and . 3DIC, page 1-6. IEEE, (2014)Over-the-top Si Interposer Embedding Backside Buried Metal PDN to Reduce Power Supply Impedance of Large Scale Digital ICs., , , , , , , , and . 3DIC, page 1-4. IEEE, (2019)Band-Stop Filter Effect of Power/Ground Plane on Through-Hole Signal Via in Multilayer PCB., , , and . IEICE Trans. Electron., 89-C (4): 551-559 (2006)PDN impedance analysis of TSV-decoupling capacitor embedded Silicon interposer for 3D-integrated CMOS image sensor system., , , , , , , , , and 2 other author(s). 3DIC, page 1-4. IEEE, (2011)SrTiO3 thin film decoupling capacitors on Si interposers for 3D system integration., , , , , and . 3DIC, page 1-5. IEEE, (2009)Investigation of effects of metalization on heat spreading in bump-bonded 3D systems., , and . 3DIC, page TS8.30.1-TS8.30.4. IEEE, (2015)Validation of TSV thermo-mechanical simulation by stress measurement., , , , and . Microelectron. Reliab., (2016)