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Disambiguation of "Aoyagi, Masahiro"

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Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit.

, , , , , , and . Microelectron. J., 46 (12): 1106-1113 (2015)

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Masahiro Noguchi

Sakae Aoyagi

Masahiro Ogawa

Masahiro Yoshida

Masahiro Katsura

 

Other publications of authors with the same name

Band-Stop Filter Effect of Power/Ground Plane on Through-Hole Signal Via in Multilayer PCB., , , and . IEICE Trans. Electron., 89-C (4): 551-559 (2006)PDN impedance analysis of TSV-decoupling capacitor embedded Silicon interposer for 3D-integrated CMOS image sensor system., , , , , , , , , and 2 other author(s). 3DIC, page 1-4. IEEE, (2011)SrTiO3 thin film decoupling capacitors on Si interposers for 3D system integration., , , , , and . 3DIC, page 1-5. IEEE, (2009)Investigation of effects of metalization on heat spreading in bump-bonded 3D systems., , and . 3DIC, page TS8.30.1-TS8.30.4. IEEE, (2015)Validation of TSV thermo-mechanical simulation by stress measurement., , , , and . Microelectron. Reliab., (2016)Ultralow impedance evaluation system of wideband frequency for power distribution network of decoupling capacitor embedded substrates., , , , , , , , , and 1 other author(s). 3DIC, page 1-4. IEEE, (2009)Hot spots suppression by high thermal conductivity film in thin-sub strate CMOS ICs for 3D integration., , , and . 3DIC, page 1-4. IEEE, (2011)Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging., , , , , , and . 3DIC, page 1-4. IEEE, (2013)3 Dimensional stacked pixel detector and sensor technology using less than 3-μmφ robust bump junctions., , , , , , and . 3DIC, page 1-4. IEEE, (2016)Guard-ring monitoring system for inspecting defects in TSV-based data buses., , and . 3DIC, page TS8.18.1-TS8.18.5. IEEE, (2015)