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Low-Power Circuit Analysis and Design Based on Heterojunction Tunneling Transistors (HETTs).

Y. Lee, D. Kim, J. Cai, I. Lauer, L. Chang, S. Koester, D. Blaauw, и D. Sylvester. IEEE Trans. Very Large Scale Integr. Syst., 21 (9): 1632-1643 (2013)

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Jin Cai

Jian Cai

Yongjie Cai

Ying Cai

Jiehua Cai

Другие публикации лиц с тем же именем

The Remote Synchronous Classroom in China.J. Cai, H. Yang, Y. Li, и J. MacLeod. ICBL, том 10309 из Lecture Notes in Computer Science, стр. 379-386. Springer, (2017)A Case Study to Promote Computational Thinking: The Lab Rotation Approach.J. Cai, H. Yang, D. Gong, J. MacLeod, и Y. Jin. ICBL, том 10949 из Lecture Notes in Computer Science, стр. 393-403. Springer, (2018)Understanding Undergraduates' Adoption of Flipped Learning: Integrating UTAUT and Social Presence.J. Cai, H. Yang, и D. Gong. ICBL, том 11546 из Lecture Notes in Computer Science, стр. 9-21. Springer, (2019)Intersection Constraint Weighting (ICW) Method: High-Resolution Joint Magnetic Susceptibility Inversion of Aeromagnetic and Gradient Data.J. Cai, G. Ma, и L. Li. Remote. Sens., 14 (23): 6029 (декабря 2022)Denoising Application of Magnetotelluric Low-Frequency Signal Processing.J. Li, F. Ma, J. Tang, Y. Liu, и J. Cai. IEEE Trans. Geosci. Remote. Sens., (2022)College Students' Computer Self-efficacy, Intrinsic Motivation, Attitude, and Satisfaction in Blended Learning Environments.Y. Li, H. Yang, J. Cai, и J. MacLeod. ICBL, том 10309 из Lecture Notes in Computer Science, стр. 65-73. Springer, (2017)An angle measurement system for bending machine based on binocular active vision.D. Meng, S. Zhao, J. Cai, M. Zhu, X. Han, и T. Guo. ICCA, стр. 924-928. IEEE, (2014)Examining key factors of beginner's continuance intention in blended learning in higher education.H. Yang, J. Cai, H. Yang, и X. Wang. J. Comput. High. Educ., 35 (1): 126-143 (апреля 2023)Systolic Building Block for Logic-on-Logic 3D-IC Implementations of Convolutional Neural Networks.H. Kung, B. McDanel, S. Zhang, C. Wang, J. Cai, C. Chen, V. Chang, M. Chen, J. Sun, и D. Yu. ISCAS, стр. 1-5. IEEE, (2019)Perspective on Low-dimensional Channel Materials for Extremely Scaled CMOS.S. Su, E. Chen, T. Hung, M. Li, G. Pitner, C. Cheng, H. Wang, J. Cai, H. Wong, и I. Radu. VLSI Technology and Circuits, стр. 403-404. IEEE, (2022)

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