( en | de | ru )

 

Disambiguation

From post

копироватьудалитьдобавить публикацию в буфер
A hybrid built-in self-test scheme for DRAMs.

, , , , , , , , и . VLSI-DAT, стр. 1-4. IEEE, (2015)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed.

Ming-tjüan Ding

Ding Ding

Ding Ding

Tin-Kwai Man

Helmar Minger

 

Другие публикации лиц с тем же именем

Application-Independent Testing of 3-D Field Programmable Gate Array Interconnect Faults., , , и . IEEE Trans. Very Large Scale Integr. Syst., 22 (2): 207-219 (2014)Scalability of Programmable FIR Digital Filters., и . VLSI Signal Processing, 21 (1): 31-35 (1999)Tight Bounds on the Diameter of Gaussian Cubes., и . Comput. J., 41 (1): 52-56 (1998)Pruned Three-Dimensional Toroidal Networks., и . Inf. Process. Lett., 68 (4): 179-183 (1998)Intra-channel Reconfigurable Interface for TSV and Micro Bump Fault Tolerance in 3-D RAMs., , , , , , , и . ATS, стр. 143-148. IEEE Computer Society, (2014)FlexiVia ROM Compiler Programmable on Different Via Layers Based on Top Metal Assignment., , , , , , , , , и 1 other автор(ы). MTDT, стр. 28-33. IEEE Computer Society, (2006)Heterogeneous chip power delivery modeling and co-synthesis for practical 3DIC realization., , , , , , и . ASP-DAC, стр. 549-553. IEEE, (2017)Worst-case IR-drop monitoring with 1GHz sampling rate., , , и . VLSI-DAT, стр. 1-4. IEEE, (2013)A Unified Formulation of Honeycomb and Diamond Networks., и . IEEE Trans. Parallel Distributed Syst., 12 (1): 74-80 (2001)Yield Enhancement by Bad-Die Recycling and Stacking With Though-Silicon Vias., , и . IEEE Trans. Very Large Scale Integr. Syst., 19 (8): 1346-1356 (2011)