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Disambiguation of "Thuries, Sébastien"

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7.5 A TCXO-less 100Hz-minimum-bandwidth transceiver for ultra-narrow-band sub-GHz IoT cellular networks.

, , , , , , , , , , and . ISSCC, page 134-135. IEEE, (2017)

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Sébastien Beyou

Sébastien Tixeuil

Sébastien Lallé

Sébastien Carcanague

Sébastien Choplin

 

Other publications of authors with the same name

Cell-on-Buffer: New design approach for high-performance and low-power monolithic 3D integrated circuits., , , and . Microelectron. J., (2017)Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells., , , , , , , , , and 2 other author(s). ISVLSI, page 539-544. IEEE Computer Society, (2017)Recent advances in 3D VLSI integration., , , , , , , , , and 7 other author(s). ICICDT, page 1-4. IEEE, (2016)IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management., , , , , , , , , and 18 other author(s). IEEE J. Solid State Circuits, 56 (1): 79-97 (2021)From 2D to Monolithic 3D: Design Possibilities, Expectations and Challenges., , , , , , , , , and 2 other author(s). ISPD, page 127. ACM, (2015)Monolithic 3D: an alternative to advanced CMOS scaling, technology perspectives and associated design methodology challenges., , , , , , and . ICECS, page 157-160. IEEE, (2018)M3D-ADTCO: Monolithic 3D Architecture, Design and Technology Co-Optimization for High Energy Efficient 3D IC., , , , , , and . DATE, page 1740-1745. IEEE, (2020)A comprehensive study of monolithic 3D cell on cell design using commercial 2D tool., , , , , , , , , and 6 other author(s). DATE, page 1192-1196. ACM, (2015)3DCoB: A new design approach for Monolithic 3D Integrated circuits., , , and . ASP-DAC, page 79-84. IEEE, (2014)Impact of intermediate BEOL technology on standard cell performances of 3D VLSI., , , , , , , , , and 3 other author(s). ESSDERC, page 218-221. IEEE, (2016)