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Configurable serial fault-tolerant link for communication in 3D integrated systems.

, , , and . IOLTS, page 115-120. IEEE Computer Society, (2010)

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Configurable fault-tolerant link for inter-die communication in 3D on-chip networks., , , and . European Test Symposium, page 258. IEEE Computer Society, (2010)Error resilience of intra-die and inter-die communication with 3D spidergon STNoC., , , , and . DATE, page 275-278. IEEE Computer Society, (2010)Impersonation Attacks on a Mobile Security Protocol for End-to-End Communications., , and . MobiSec, volume 17 of Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering, page 278-287. Springer, (2009)Configurable Thru-Silicon-Via interconnect Built-In Self-Test and diagnosis., , and . LATW, page 1-6. IEEE, (2011)Fault tolerant communication in 3D integrated systems., , and . DSN Workshops, page 131-135. IEEE Computer Society, (2010)Through-silicon-via built-in self-repair for aggressive 3D integration., , and . IOLTS, page 91-96. IEEE Computer Society, (2012)Efficient link-level error resilience in 3D NoCs., , , and . DDECS, page 127-132. IEEE, (2012)Configurable serial fault-tolerant link for communication in 3D integrated systems., , , and . IOLTS, page 115-120. IEEE Computer Society, (2010)Kth-Aggressor Fault (KAF)-based Thru-Silicon-Via Interconnect Built-In Self-Test and Diagnosis., , and . J. Electron. Test., 28 (6): 817-829 (2012)CSL: Configurable Fault Tolerant Serial Links for Inter-die Communication in 3D Systems., , , and . J. Electron. Test., 28 (1): 137-150 (2012)