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Disambiguation of "Tan, Chuan Seng"

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The dependency of TSV keep-out zone (KOZ) on Si crystal direction and liner material.

, , , , , , and . 3DIC, page 1-5. IEEE, (2013)

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Chuan-Cheng Tan

Shih-yu Chuang

Jen-Yang Chuang

Jing-Jing Chuang

Mei-Ling Chuang

 

Other publications of authors with the same name

Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation., , , and . Microelectron. Reliab., (2016)Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement., , , , and . Microelectron. Reliab., 52 (2): 321-324 (2012)Robust Electromigration reliability through engineering optimization., , , , , , and . Microelectron. Reliab., 54 (9-10): 1666-1670 (2014)Mid Infrared Volatile Compounds Detection Using Thermally Reflowed Flip-Stack Die Linear Variable Filter., , , and . IEEE SENSORS, page 1-4. IEEE, (2019)Impact of thermal through silicon via (TTSV) on the temperature profile of multi-layer 3-D device stack., and . 3DIC, page 1-4. IEEE, (2009)Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation., , , , , and . 3DIC, page 1-5. IEEE, (2009)Integration of CNT in TSV (≤5 μm) for 3D IC application and its process challenges., , , and . 3DIC, page 1-4. IEEE, (2013)Simulation and design of AIN piezoelectric resonator for infrared sensing application utilizing lamb wave mode., , , , , and . ISSNIP, page 1-6. IEEE, (2014)Three-Dimensional Integration of Integrated Circuits - an Introduction.. 3D Integration for NoC-based SoC Architectures, Springer, (2011)Multi-layer 3D silicon electronics enabled by wafer bonding.. Massachusetts Institute of Technology, Cambridge, MA, USA, (2006)ndltd.org (oai:dspace.mit.edu:1721.1/37879).