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Time Dependent Variability in Advanced FinFET Technology for End-of-Lifetime Reliability Prediction.

, , , , , , , and . IRPS, page 1-6. IEEE, (2021)

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Systematic Study of Process Impact on FinFET Reliability., , , , , , , , , and 5 other author(s). IRPS, page 1-5. IEEE, (2021)Advanced Self-heating Model and Methodology for Layout Proximity Effect in FinFET Technology., , , , , , , , , and 3 other author(s). IRPS, page 1-5. IEEE, (2020)Reliability of Industrial grade Embedded-STT-MRAM., , , , , , , , , and 21 other author(s). IRPS, page 1-3. IEEE, (2020)Reliability on EUV Interconnect Technology for 7nm and beyond., , , , , , , , , and 7 other author(s). IRPS, page 1-4. IEEE, (2020)Chip to Package Interaction Risk Assessment of FCBGA Devices using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique., , , , , , and . IRPS, page 1-6. IEEE, (2021)Time Dependent Variability in Advanced FinFET Technology for End-of-Lifetime Reliability Prediction., , , , , , , and . IRPS, page 1-6. IEEE, (2021)Soft-Error Susceptibility in Flip-Flop in EUV 7 nm Bulk-FinFET Technology., , , , , , , , , and 1 other author(s). IRPS, page 1-7. IEEE, (2021)Trap Density Modulation for IO FinFET NBTI Improvement., , , , , , , , , and 5 other author(s). IRPS, page 1-5. IEEE, (2020)Investigating of SER in 28 nm FDSOI-Planar and Comparing with SER in Bulk-FinFET., , , , , , , , , and 6 other author(s). IRPS, page 1-5. IEEE, (2020)Backside Alpha-Irradiation Test in Flip-Chip Package in EUV 7 nm FinFET SRAM., , , , , , , , , and 4 other author(s). IRPS, page 1-4. IEEE, (2020)