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Disambiguation of "Knickerbocker, John U."

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High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution.

, , , , , , , , , , and . IBM J. Res. Dev., 36 (5): 889-904 (1992)

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U Siddiqui

U Eysholdt

U Lechner

U Johanningmeier

U Jaehde

 

Other publications of authors with the same name

An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects., , , , , , , , , and 4 other author(s). IEEE J. Solid State Circuits, 47 (4): 884-896 (2012)An advanced multichip module (MCM) for high-performance UNIX servers., , , , , , , , , and 14 other author(s). IBM J. Res. Dev., 46 (6): 779-804 (2002)Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection., , , , , , , , , and 10 other author(s). IBM J. Res. Dev., 49 (4-5): 725-754 (2005)3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias., , , , , , , , , and 1 other author(s). IEEE J. Solid State Circuits, 41 (8): 1718-1725 (2006)High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution., , , , , , , , , and 1 other author(s). IBM J. Res. Dev., 36 (5): 889-904 (1992)Thermomechanical modeling of 3D electronic packages., , , and . IBM J. Res. Dev., 52 (6): 623-634 (2008)Three-dimensional silicon integration., , , , , , , , , and 6 other author(s). IBM J. Res. Dev., 52 (6): 553-569 (2008)Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology., , , , , , , , , and 5 other author(s). CICC, page 659-662. IEEE, (2005)Back to Finger-Writing: Fingertip Writing Technology Based on Pressure Sensing., , , and . IEEE Access, (2020)IBM System/390 air-cooled alumina thermal conduction module., , , , , and . IBM J. Res. Dev., 35 (3): 330-341 (1991)