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Exploiting CMOS reverse interconnect scaling in multigigahertz amplifier and oscillator design.

, , , , , and . IEEE J. Solid State Circuits, 36 (10): 1480-1488 (2001)

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Correction to "exploiting CMOS reverse interconnect scaling in multigigahertz amplifier and oscillator design"., , , , , and . IEEE J. Solid State Circuits, 37 (2): 255 (2002)Circuit-level electrothermal simulation of electrical overstress failures in advanced MOS I/O protection devices., , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 13 (4): 482-493 (1994)A scaleable model for STI mechanical stress effect on layout dependence of MOS electrical characteristics., , , , , , , , , and 1 other author(s). CICC, page 245-248. IEEE, (2003)Challenges toward Low-Power SOT-MRAM., , , , , , , , , and 5 other author(s). IRPS, page 1-7. IEEE, (2021)28nm metal-gate high-K CMOS SoC technology for high-performance mobile applications., , , , , , , , , and 23 other author(s). CICC, page 1-5. IEEE, (2011)Thermal Failure Simulation for Electrical Overstress in Semiconductor Devices., , and . ISCAS, page 1389-1392. IEEE, (1993)Process and circuit design interlock for application-dependent scaling tradeoffs and optimization in the SoC era., , , and . IEEE J. Solid State Circuits, 38 (3): 444-449 (2003)Exploiting CMOS reverse interconnect scaling in multigigahertz amplifier and oscillator design., , , , , and . IEEE J. Solid State Circuits, 36 (10): 1480-1488 (2001)Application-dependent scaling tradeoffs and optimization in the SoC era., , , and . CICC, page 475-478. IEEE, (2002)Device trends and implications on circuit design in advanced CMOS technologies., , , , , , , , , and 1 other author(s). CICC, page 675-679. IEEE, (2005)