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Lateral punch-through TVS devices for on-chip protection in low-voltage applications., , , , , and . Microelectron. Reliab., 45 (7-8): 1181-1186 (2005)Robustness test and failure analysis of IGBT modules during turn-off., , , , , and . Microelectron. Reliab., 47 (9-11): 1725-1729 (2007)Experimental analysis of planar edge terminations for high voltage 4H-SiC devices., , , , , , and . ESSDERC, page 68-71. IEEE, (2015)Analysis of Clamped Inductive Turnoff Failure in Railway Traction IGBT Power Modules Under Overload Conditions., , , , , , , and . IEEE Trans. Ind. Electron., 58 (7): 2706-2714 (2011)Long-Term Reliability of Railway Power Inverters Cooled by Heat-Pipe-Based Systems., , , , and . IEEE Trans. Ind. Electron., 58 (7): 2662-2672 (2011)High-Voltage 4H-SiC Power MOSFETs With Boron-Doped Gate Oxide., , , , , , , , , and . IEEE Trans. Ind. Electron., 64 (11): 8962-8970 (2017)IGBT module failure analysis in railway applications., , , , , , , and . Microelectron. Reliab., 48 (8-9): 1427-1431 (2008)Analysis of punch-through breakdown in bulk silicon RF power LDMOS transistors., , , , and . Microelectron. Reliab., 48 (2): 173-180 (2008)Analysis of hot-carrier degradation in a SOI LDMOS transistor with a steep retrograde drift doping profile., , , , , and . Microelectron. Reliab., 45 (3-4): 493-498 (2005)Reduction of self-heating effect on SOIM devices., , , , and . Microelectron. Reliab., 42 (1): 61-66 (2002)