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A 1 Tb/s 3 W Inductive-Coupling Transceiver for 3D-Stacked Inter-Chip Clock and Data Link.

, , , , , , , , and . IEEE J. Solid State Circuits, 42 (1): 111-122 (2007)

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A 195-gb/s 1.2-W inductive inter-chip wireless superconnect with transmit power control scheme for 3-D-stacked system in a package., , , , and . IEEE J. Solid State Circuits, 41 (1): 23-34 (2006)Analysis and design of inductive coupling and transceiver circuit for inductive inter-chip wireless superconnect., , , and . IEEE J. Solid State Circuits, 40 (4): 829-837 (2005)Cross talk countermeasures in inductive inter-chip wireless superconnect., , , and . CICC, page 99-102. IEEE, (2004)Lookahead Scheduling Requests for Multisize Page Caching., , and . IEEE Trans. Computers, 50 (9): 972-983 (2001)A 1Tb/s 3W inductive-coupling transceiver for inter-chip clock and data link., , , , , , , , and . ISSCC, page 1676-1685. IEEE, (2006)Constant Magnetic Field Scaling in Inductive-Coupling Data Link., , , and . IEICE Trans. Electron., 91-C (2): 200-205 (2008)A 1.2 Gbps Non-contact 3D-Stacked Inter-Chip Data Communications Technology., , , and . IEICE Trans. Electron., 89-C (3): 320-326 (2006)A 1 Tb/s 3 W Inductive-Coupling Transceiver for 3D-Stacked Inter-Chip Clock and Data Link., , , , , , , , and . IEEE J. Solid State Circuits, 42 (1): 111-122 (2007)