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A 1 Tb/s 3 W Inductive-Coupling Transceiver for 3D-Stacked Inter-Chip Clock and Data Link.

, , , , , , , , and . IEEE J. Solid State Circuits, 42 (1): 111-122 (2007)

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A 1Tb/s 3W inductive-coupling transceiver for inter-chip clock and data link., , , , , , , , and . ISSCC, page 1676-1685. IEEE, (2006)Daisy Chain Transmitter for Power Reduction in Inductive-Coupling CMOS Link., , , , , , , and . IEICE Trans. Electron., 90-C (4): 829-835 (2007)Ultra-high-density interconnection technology of three-dimensional packaging., , , , , , , and . Microelectron. Reliab., 43 (8): 1267-1279 (2003)A 3-D Packaging Technology with Highly-Parallel Memory/Logic Interconnect., , , , , , , , and . IEICE Trans. Electron., 92-C (12): 1512-1522 (2009)An Inductive-Coupling DC Voltage Transceiver for Highly Parallel Wafer-Level Testing., , , , , , , and . IEEE J. Solid State Circuits, 45 (10): 2057-2065 (2010)A 1 Tb/s 3 W Inductive-Coupling Transceiver for 3D-Stacked Inter-Chip Clock and Data Link., , , , , , , , and . IEEE J. Solid State Circuits, 42 (1): 111-122 (2007)Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing., , , , , , , and . ISSCC, page 470-471. IEEE, (2009)