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GaN RF HEMT Reliability: Impact of Device Processing on I-V Curve Stability and Current Collapse., , , , , , , , , and 2 other author(s). IRPS, page 11. IEEE, (2022)Threshold Voltage Drift and Recovery of SiC Trench MOSFETs During TDDB Stress., , , , , , , and . IRPS, page 54. IEEE, (2024)Charge Trapping in GaN Power Transistors: Challenges and Perspectives., , , , , , , , , and 1 other author(s). BCICTS, page 1-4. IEEE, (2021)Role of Gate Hole Injection in Minimizing Substrate Coupling and Electron Trapping in AlGaN/GaN Power HEMTs., , , , and . IRPS, page 17. IEEE, (2024)Demonstration of Bilayer Gate Insulator for Improved Reliability in GaN-on-Si Vertical Transistors., , , , , , , , , and . IRPS, page 1-5. IEEE, (2020)On-Wafer Dynamic Operation of Power GaN-HEMTs: Degradation Processes Investigated by a Novel Experimental Approach., , , , , , , , , and . IRPS, page 1-5. IEEE, (2024)Current crowding as a major cause for InGaN LED degradation at extreme high current density., , , , , and . IECON, page 1-6. IEEE, (2021)Degradation of vertical GaN FETs under gate and drain stress., , , , , , and . IRPS, page 4. IEEE, (2018)Thermally-activated failure mechanisms of 0.25 \ m$ RF AIGaN/GaN HEMTs submitted to long-term life tests., , , , , , , and . IRPS, page 1-5. IEEE, (2023)Role of the AlGaN Cap Layer on the Trapping Behaviour of N-Polar GaN MISHEMTs., , , , , , , , , and 4 other author(s). IRPS, page 1-2. IEEE, (2021)