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A New LSI Performance Prediction Model for Interconnection Analysis of Future LSIs.

, , and . ASP-DAC, page 51-56. IEEE, (1998)

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A Novel Monitoring Method of RF Characteristics Variations for Sub-0.1μm MOSFETs with Precise Gate-resistance Model., , and . CICC, page 725-728. IEEE, (2006)13.4 A 6.3mW BLE transceiver embedded RX image-rejection filter and TX harmonic-suppression filter reusing on-chip matching network., , , , , , , , , and . ISSCC, page 1-3. IEEE, (2015)27.6 Single-chip 3072ch 2D array IC with RX analog and all-digital TX beamformer for 3D ultrasound imaging., , , , , , , , , and 4 other author(s). ISSCC, page 458-459. IEEE, (2017)T/R-Switch Composed of 3 High-Voltage MOSFETs with 12.1 µW Consumption that can Perform Per-channel TX to RX Self-Loopback AC Tests for 3D Ultrasound Imaging with 3072-channel Transceiver., , , , , , , , and . A-SSCC, page 305-308. IEEE, (2019)SMiPoly: Generation of a Synthesizable Polymer Virtual Library Using Rule-Based Polymerization Reactions., , , , and . J. Chem. Inf. Model., 63 (17): 5539-5548 (September 2023)A New LSI Performance Prediction Model for Interconnection Analysis of Future LSIs., , and . ASP-DAC, page 51-56. IEEE, (1998)Single-Chip 3072-Element-Channel Transceiver/128-Subarray-Channel 2-D Array IC With Analog RX and All-Digital TX Beamformer for Echocardiography., , , , , , , , , and 4 other author(s). IEEE J. Solid State Circuits, 54 (9): 2555-2567 (2019)Multi-Step Word-Line Control Technology in Hierarchical Cell Architecture for Scaled-Down High-Density SRAMs., , , , , , , , , and . IEEE J. Solid State Circuits, 46 (4): 806-814 (2011)Acceleration of Liquid-Crystalline Phase Transition Simulations Using Selectively Scaled and Returned Molecular Dynamics., , and . J. Chem. Inf. Model., 60 (7): 3499-3507 (2020)T/R Switch Composed of Three HV-MOSFETs With 12.1-μW Consumption That Enables Per-Channel Self-Loopback AC Tests and -18.1-dB Switching Noise Suppression for 3-D Ultrasound Imaging With 3072-Ch Transceiver., , , , , , , , , and 1 other author(s). IEEE Trans. Very Large Scale Integr. Syst., 30 (2): 153-165 (2022)