%0 Conference Paper %1 conf/3dic/LeducACZSRRVBBCFS09 %A Leduc, Patrick %A Assous, Myriam %A Cioccio, Léa Di %A Zussy, Marc %A Signamarcheix, Thomas %A Roman, Antonio %A Rousseau, Maxime %A Verrun, Sophie %A Bally, Laurent %A Bouchu, David %A Cadix, Lionel %A Farcy, Alexis %A Sillon, Nicolas %B 3DIC %D 2009 %I IEEE %K dblp %P 1-5 %T First integration of Cu TSV using die-to-wafer direct bonding and planarization. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#LeducACZSRRVBBCFS09 %@ 978-1-4244-4512-7

@inproceedings{conf/3dic/LeducACZSRRVBBCFS09, added-at = {2017-05-21T00:00:00.000+0200}, author = {Leduc, Patrick and Assous, Myriam and Cioccio, Léa Di and Zussy, Marc and Signamarcheix, Thomas and Roman, Antonio and Rousseau, Maxime and Verrun, Sophie and Bally, Laurent and Bouchu, David and Cadix, Lionel and Farcy, Alexis and Sillon, Nicolas}, biburl = {https://www.bibsonomy.org/bibtex/212b2b5e315e5fd4fdbfa67de256bdb5a/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2009}, ee = {https://doi.org/10.1109/3DIC.2009.5306602}, interhash = {7473797d4c07cca1b15502136c02f867}, intrahash = {12b2b5e315e5fd4fdbfa67de256bdb5a}, isbn = {978-1-4244-4512-7}, keywords = {dblp}, pages = {1-5}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:22.000+0200}, title = {First integration of Cu TSV using die-to-wafer direct bonding and planarization.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#LeducACZSRRVBBCFS09}, year = 2009 }