Author of the publication

Metal-catalyst free integration of SiO2 nanowires into carbon MEMS.

, , , , , and . NEMS, page 734-737. IEEE, (2013)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Defect detection of flip-chip solder joints using modal analysis., , , , and . Microelectron. Reliab., 52 (12): 3002-3010 (2012)Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer., , , , and . Sensors, 13 (12): 16281-16291 (2013)Multiband Envelope Spectra Extraction for Fault Diagnosis of Rolling Element Bearings., , , , and . Sensors, 18 (5): 1466 (2018)Tool Wear Monitoring in Milling Based on Fine-Grained Image Classification of Machined Surface Images., , , , , and . Sensors, 22 (21): 8416 (2022)Transfer reinforcement learning method with multi-label learning for compound fault recognition., , , , and . Adv. Eng. Informatics, (January 2023)Improved adhesion between C-MEMS and substrate by micromechanical interlocking., , , , , and . NEMS, page 624-627. IEEE Computer Society, (2009)Low temperature direct bonding for hermetic wafer level packaging., , , , and . NEMS, page 472-475. IEEE Computer Society, (2009)Gear Crack Detection Using Kernel Function Approximation., , and . ICONIP (3), volume 4234 of Lecture Notes in Computer Science, page 535-544. Springer, (2006)Genetic algorithms for defect detection of flip chips., , , , and . Microelectron. Reliab., 55 (1): 213-220 (2015)Using active thermography for defects inspection of flip chip., , , and . Microelectron. Reliab., 54 (4): 808-815 (2014)