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Disambiguation of "Moreau, Stéphane"

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Spectral recycling strategies for the solution of nonlinear eigenproblems in thermoacoustics.

, , , and . Numerical Lin. Alg. with Applic., 22 (6): 1039-1058 (2015)

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Stéphane Haussler

Stéphane Klein

Stéphane Müller

Stéphane Grabli

Stéphane Weiss

 

Other publications of authors with the same name

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric., , , , , , , , , and . Microelectron. Reliab., 53 (1): 17-29 (2013)MetaSurv: Web-Platform Generator for the Monitoring of Health Indicators and Interactive Geographical Information System., , and . MIE, volume 116 of Studies in Health Technology and Informatics, page 989-993. IOS Press, (2005)200°C direct bonding copper interconnects : Electrical results and reliability., , , , , and . 3DIC, page 1-4. IEEE, (2011)Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding., , , , , , , , , and . 3DIC, page 1-8. IEEE, (2014)Electromigration Test Chip Experiments from Realistic Power Grid Structures: Failure Trend Comparison and Statistical Analysis., , , , , and . IRPS, page 1-6. IEEE, (2024)3D interconnection using copper direct hybrid bonding for GaN on silicon wafer., , , , , , , and . 3DIC, page 1-4. IEEE, (2021)Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits., , , , , , and . IRPS, page 1-7. IEEE, (2023)New Method to Perform TDDB Tests for Hybrid Bonding Interconnects., , , , , , and . IRPS, page 4. IEEE, (2022)Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects., , , , and . ISPD, page 85-90. ACM, (2024)Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability., , , , , , , , , and 7 other author(s). IRPS, page 4. IEEE, (2018)