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Femtosecond Laser Ablation for Backside Silicon Thinning., , , , and . Microelectron. Reliab., 44 (9-11): 1605-1609 (2004)Dynamic Laser Stimulation Case Studies., , , , , , and . Microelectron. Reliab., 45 (9-11): 1538-1543 (2005)Modeling Thermal Laser Stimulation., , , , , and . Microelectron. Reliab., 41 (9-10): 1477-1482 (2001)Failure analysis of micro-heating elements suspended on thin membranes., , , , , and . Microelectron. Reliab., 45 (9-11): 1786-1789 (2005)Reliability Defect Monitoring with Thermal Laser Stimulation: Biased Versus Unbiased., , , , , and . Microelectron. Reliab., 42 (9-11): 1729-1734 (2002)Time Resolved Photoemission (PICA) - From the Physics to Practical Considerations., , , , , and . Microelectron. Reliab., 43 (9-11): 1639-1644 (2003)Magnetic Microscopy for IC Failure Analysis: Comparative Case Studies using SQUID, GMR and MTJ systems., , , , , , and . Microelectron. Reliab., 44 (9-11): 1559-1563 (2004)Silicon Thinning and Polishing on Packaged Devices., , , , and . Microelectron. Reliab., 41 (9-10): 1557-1561 (2001)Faster IC Analysis with PICA Spatial Temporal Photon Correlation and CAD Autochanneling., , , , , , , and . Microelectron. Reliab., 43 (9-11): 1663-1668 (2003)Time Resolved Photon Emission Processing Flow for IC Analysis., , , , , and . Microelectron. Reliab., 44 (9-11): 1655-1662 (2004)