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Silicon Thinning and Polishing on Packaged Devices., , , , and . Microelectron. Reliab., 41 (9-10): 1557-1561 (2001)Faster IC Analysis with PICA Spatial Temporal Photon Correlation and CAD Autochanneling., , , , , , , and . Microelectron. Reliab., 43 (9-11): 1663-1668 (2003)Application of various optical techniques for ESD defect localization., , , , , , , , , and . Microelectron. Reliab., 46 (9-11): 1563-1568 (2006)Low Frequency Noise Measurements for ESD Latent Defect Detection in High Reliability Applications., , , , , , , , and . Microelectron. Reliab., 44 (9-11): 1781-1786 (2004)Time Resolved Photon Emission Processing Flow for IC Analysis., , , , , and . Microelectron. Reliab., 44 (9-11): 1655-1662 (2004)Long-term reliability of silicon bipolar transistors subjected to low constraints., , , , , , and . Microelectron. Reliab., 47 (9-11): 1590-1594 (2007)A comprehensive study of the application of the EOP techniques on bipolar devices., , , , , , and . Microelectron. Reliab., 54 (9-10): 2088-2092 (2014)Time Resolved Photoemission (PICA) - From the Physics to Practical Considerations., , , , , and . Microelectron. Reliab., 43 (9-11): 1639-1644 (2003)Magnetic Microscopy for IC Failure Analysis: Comparative Case Studies using SQUID, GMR and MTJ systems., , , , , , and . Microelectron. Reliab., 44 (9-11): 1559-1563 (2004)Frequency mapping in dynamic light emission with wavelet transform., , , , and . Microelectron. Reliab., 53 (9-11): 1387-1392 (2013)