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Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters.

Y. Yi, C. Kim, C. Zhou, A. Kteyan, and V. Sukharev. IRPS, page 1-5. IEEE, (2023)

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Armen Grigorjan

Armen Khachatryan

Armen Vartapetian

Emmanouil Armentsoudis

Armen Haghnazarian

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Control of design specific variation in etch-assisted via pattern transfer by means of full-chip simulation.V. Sukharev, A. Markosian, A. Kteyan, L. Manukyan, N. Khachatryan, J. Choy, H. Lazaryan, H. Hovsepyan, S. Onoue, T. Kikuchi and 1 other author(s). ISQED, page 156-161. IEEE Computer Society, (2009)Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance.V. Sukharev, A. Kteyan, J. Choy, H. Hovsepyan, A. Markosian, E. Zschech, and R. Huebner. J. Electron. Test., 28 (1): 63-72 (2012)Assesment of CPI Stress Impact on IC Reliability and Performance in 2.5D/3D Packages.A. Kteyan, H. Hovsepyan, J. Choy, and V. Sukharev. IRPS, page 1-7. IEEE, (2019)Novel Methodology for Assessing Chip-Package Interaction Effects onChip Performance.A. Kteyan, J. Choy, V. Sukharev, M. Bertoletti, C. Maiorca, R. Zadra, M. Inzaghi, G. Gattere, G. Zinco, P. Valente and 6 other author(s). ISPD, page 83-89. ACM, (2022)An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems.V. Sukharev, A. Kteyan, and J. Choy. 3DIC, page 1-6. IEEE, (2019)Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks.X. Huang, A. Kteyan, S. Tan, and V. Sukharev. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 35 (11): 1848-1861 (2016)Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution.A. Kteyan, V. Sukharev, A. Volkov, J. Choy, F. Najm, Y. Yi, C. Kim, and S. Moreau. ISPD, page 124-132. ACM, (2023)Post placement leakage reduction with stress-enhanced filler cells.J. Choy, V. Sukharev, A. Kteyan, H. Hovsepyan, R. Venkatraman, and R. Castagnetti. ISLPED, page 303-308. IEEE, (2015)Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters.Y. Yi, C. Kim, C. Zhou, A. Kteyan, and V. Sukharev. IRPS, page 1-5. IEEE, (2023)Novel methodology for temperature-aware electromigration assessment in on-chip power grid: simulations and experimental validation (Invited).A. Kteyan, V. Sukharev, Y. Yi, and C. Kim. IRPS, page 8. IEEE, (2022)

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Disambiguation of "Kteyan, Armen"

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Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters.

Please choose a person to relate this publication to

Armen Grigorjan

Armen Khachatryan

Armen Vartapetian

Emmanouil Armentsoudis

Armen Haghnazarian

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Kteyan, Armen"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters.

Please choose a person to relate this publication to

Armen Grigorjan

Armen Khachatryan

Armen Vartapetian

Emmanouil Armentsoudis

Armen Haghnazarian

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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MSOffice XML

Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters.