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Cu pumping in TSVs: Effect of pre-CMP thermal budget.

I. Wolf, K. Croes, O. Pedreira, R. Labie, A. Redolfi, M. Peer, K. Vanstreels, C. Okoro, B. Vandevelde, and E. Beyne. Microelectron. Reliab., 51 (9-11): 1856-1859 (2011)

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Ingrid Wolf

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MEMS reliability.I. Wolf. Microelectron. Reliab., 43 (7): 1047-1048 (2003)Editorial.G. Groeseneken, I. Wolf, A. Mouthaan, and J. Bisschop. Microelectron. Reliab., 48 (8-9): 1111 (2008)Wafer-Level Aging of InGaAs/GaAs Nano-Ridge p-i-n Diodes Monolithically Integrated on Silicon.P. Hsieh, A. Tsiara, B. O'Sullivan, D. Yudistira, M. Baryshnikova, G. Groeseneken, B. Kunert, M. Pantouvaki, J. Campenhout, and I. Wolf. IRPS, page 9. IEEE, (2022)Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters.Y. Ding, O. Pedreira, M. Lofrano, H. Zahedmanesh, T. Chavez, H. Farr, I. Wolf, and K. Croes. IRPS, page 1-7. IEEE, (2023)Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis.A. Khaled, S. Brand, M. Kögel, T. Appenroth, and I. Wolf. Microelectron. Reliab., (2016)Impact of Mechanical Stress on the Electrical Performance of 3D NAND.A. Kruv, A. Arreghini, M. Gonzalez, D. Verreck, G. den Bosch, I. Wolf, and A. Furnémont. IRPS, page 1-5. IEEE, (2019)Impact of design factors and environment on the ESD sensitivity of MEMS micromirrors.S. Sangameswaran, J. Coster, G. Groeseneken, and I. Wolf. Microelectron. Reliab., 50 (9-11): 1383-1387 (2010)Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.G. der Plas, P. Limaye, I. Loi, A. Mercha, H. Oprins, C. Torregiani, S. Thijs, D. Linten, M. Stucchi, G. Katti and 27 other author(s). IEEE J. Solid State Circuits, 46 (1): 293-307 (2011)Fast convolution based thermal model for 3D-ICs: Methodology, accuracy analysis and package impact.F. Maggioni, H. Oprins, E. Beyne, I. Wolf, and M. Baelmans. Microelectron. J., 45 (12): 1746-1752 (2014)Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.L. Kljucar, M. Gonzalez, I. Wolf, K. Croes, J. Bömmels, and Z. Tökei. Microelectron. Reliab., (2016)

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Disambiguation of "Wolf, Ingrid De"

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Cu pumping in TSVs: Effect of pre-CMP thermal budget.

Please choose a person to relate this publication to

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Wolf, Ingrid De"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Cu pumping in TSVs: Effect of pre-CMP thermal budget.

Please choose a person to relate this publication to

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Other publications of authors with the same name

Disambiguation

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DOI
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Cu pumping in TSVs: Effect of pre-CMP thermal budget.