( en | de | ru )

 

Disambiguation of "Redolfi, Augusto"

Author of the publication

copydeleteadd this publication to your clipboard
Cu pumping in TSVs: Effect of pre-CMP thermal budget.

, , , , , , , , , and . Microelectron. Reliab., 51 (9-11): 1856-1859 (2011)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Augusto Mangini

Augusto Lautz

Augusto Araújo

Augusto Minatta

Augusto Uasuf

 

Other publications of authors with the same name

Optimization of the write algorithm at low-current (10μA) in Cu/Al2O3-based conductive-bridge RAM., , , , , and . ESSDERC, page 114-117. IEEE, (2015)Cu pumping in TSVs: Effect of pre-CMP thermal budget., , , , , , , , , and . Microelectron. Reliab., 51 (9-11): 1856-1859 (2011)Migrating from planar to FinFET for further CMOS scaling: SOI or bulk?, , , , , , , , , and 9 other author(s). ESSCIRC, page 84-87. IEEE, (2009)Engineering of a TiN\Al2O3\(Hf, Al)O2\Ta2O5\Hf RRAM cell for fast operation at low current., , , , , , and . ESSDERC, page 262-265. IEEE, (2015)3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps., , , , , , , , , and 9 other author(s). ICICDT, page 1-4. IEEE, (2012)Enhancement of CBRAM performance by controlled formation of a hourglass-shaped filament., , , , , , and . NVMTS, page 1-5. IEEE, (2017)Projeto de fabricação de HBTs.. University of Campinas, Brazil, (1999)ndltd.org (oai:repositorio.unicamp.br:REPOSIP/260828).