( en | de | ru )

 

Disambiguation

From post

копироватьудалитьдобавить публикацию в буфер
Improved adhesion between C-MEMS and substrate by micromechanical interlocking.

, , , , , и . NEMS, стр. 624-627. IEEE Computer Society, (2009)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed.

Bingzi Liao

Aihua Liao

Yunxiang Liao

Yixiang Liao

Limin Liao

 

Другие публикации лиц с тем же именем

Defect detection of flip-chip solder joints using modal analysis., , , , и . Microelectron. Reliab., 52 (12): 3002-3010 (2012)Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer., , , , и . Sensors, 13 (12): 16281-16291 (2013)Improved adhesion between C-MEMS and substrate by micromechanical interlocking., , , , , и . NEMS, стр. 624-627. IEEE Computer Society, (2009)Low temperature direct bonding for hermetic wafer level packaging., , , , и . NEMS, стр. 472-475. IEEE Computer Society, (2009)A pattern matching method using geometric information of images., , , , и . NEMS, стр. 33-36. IEEE, (2011)Using Wavelet Packet Transform for Surface Roughness Evaluation and Texture Extraction., , , , , и . Sensors, 17 (4): 933 (2017)Sparse Reconstruction for Micro Defect Detection in Acoustic Micro Imaging., , , , , , и . Sensors, 16 (10): 1773 (2016)Image registration using a point-line duality based line matching method., , , и . J. Vis. Commun. Image Represent., 24 (5): 615-626 (2013)A Novel Technique for Data Visualization Based on SOM., , , и . ICANN (1), том 3696 из Lecture Notes in Computer Science, стр. 421-426. Springer, (2005)Microscopic Three-Dimensional Measurement Based on Telecentric Stereo and Speckle Projection Methods., , , , и . Sensors, 18 (11): 3882 (2018)