Author of the publication

Incorporating contracts with retailer into product line extension using Stackelberg game and nested bi-level genetic algorithms.

, , , and . Comput. Ind. Eng., (2021)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Do air pollution emissions and fuel consumption models for roadways include the effects of congestion in the roadway traffic flow?, , and . Environ. Model. Softw., 23 (10-11): 1262-1270 (2008)Complete blow-up of solutions for degenerate semilinear parabolic first initial-boundary value problems., and . Appl. Math. Comput., 177 (2): 777-784 (2006)Existence of classical solutions for degenerate semilinear parabolic problems., and . Appl. Math. Comput., 101 (2-3): 125-149 (1999)Parabolic problems with nonlinear absorptions and releases at the boundaries., and . Appl. Math. Comput., 121 (2-3): 203-209 (2001)Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging., , , , and . Microelectron. Reliab., 44 (5): 823-831 (2004)Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies., , and . Microelectron. Reliab., 42 (3): 381-389 (2002)Reliability of microBGA assembly using no-flow underfill., , and . Microelectron. Reliab., 41 (12): 1993-2000 (2001)Study of the self-alignment of no-flow underfill for micro-BGA assembly., , and . Microelectron. Reliab., 41 (11): 1867-1875 (2001)Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads., , , , and . Microelectron. Reliab., 50 (12): 2051-2058 (2010)Intelligent E-Vendor Relationship Management for Enhancing Global B2C E-Commerce Ecosystems., , , and . J. Glob. Inf. Manag., 29 (3): 1-25 (2021)