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Disambiguation of "Shin, Dong-Hak"

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Efficient compression scheme by use of the region division of elemental images on MALT in three-dimensional integral imaging.

, , , and . Three-Dimensional Image Processing (3DIP) and Applications, volume 7526 of SPIE Proceedings, page 75260I. SPIE, (2010)

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Dong-Shin Shin

Dong-Hak Kim

Dong Woon Shin

Dong-Ook Shin

Dong-In Shin

 

Other publications of authors with the same name

Viewing Angle-Improved 3D Integral Imaging Display with Eye Tracking Sensor., , , and . J. Inform. and Commun. Convergence Engineering, 12 (4): 208-214 (2014)Efficient compression scheme by use of the region division of elemental images on MALT in three-dimensional integral imaging., , , and . Three-Dimensional Image Processing (3DIP) and Applications, volume 7526 of SPIE Proceedings, page 75260I. SPIE, (2010)A 1.2 V 20 nm 307 GB/s HBM DRAM With At-Speed Wafer-Level IO Test Scheme and Adaptive Refresh Considering Temperature Distribution., , , , , , , , , and 9 other author(s). IEEE J. Solid State Circuits, 52 (1): 250-260 (2017)A 16-GB 640-GB/s HBM2E DRAM With a Data-Bus Window Extension Technique and a Synergetic On-Die ECC Scheme., , , , , , , , , and 16 other author(s). IEEE J. Solid State Circuits, 56 (1): 199-211 (2021)18.2 A 1.2V 20nm 307GB/s HBM DRAM with at-speed wafer-level I/O test scheme and adaptive refresh considering temperature distribution., , , , , , , , , and 11 other author(s). ISSCC, page 316-317. IEEE, (2016)Vision-Based 3D Fingertip Interface for Spatial Interaction in 3D Integral Imaging System., , , , and . CISIS, page 1006-1011. IEEE Computer Society, (2009)22.1 A 1.1V 16GB 640GB/s HBM2E DRAM with a Data-Bus Window-Extension Technique and a Synergetic On-Die ECC Scheme., , , , , , , , , and 25 other author(s). ISSCC, page 330-332. IEEE, (2020)