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Disambiguation of "Fiori, Vincent"

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Wafer level measurements and numerical analysis of self-heating phenomena in nano-scale SOI MOSFETs.

, , , , and . Microelectron. Reliab., (2016)

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Anja Fiori

Wolfgang Fiori

Stella Fiori

Regina Fiorito

Camilla Fiorini

 

Other publications of authors with the same name

Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments., , , , , , , , , and 1 other author(s). 3DIC, page 1-7. IEEE, (2013)Numerical analysis of thermo-mechanical and mobility effects for 28 nm node and beyond: Comparison and design consequences over bumping technologies., , , , and . Microelectron. Reliab., 54 (4): 764-772 (2014)Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits., , , , , , , , , and 6 other author(s). IEEE Des. Test, 33 (3): 21-36 (2016)Using TSVs for thermal mitigation in 3D circuits: Wish and truth., , , , , , , , , and 1 other author(s). 3DIC, page 1-8. IEEE, (2014)Stress management strategy to limit die curvature during silicon interposer integration., , , , , , , , , and 1 other author(s). 3DIC, page TS11.4.1-TS11.4.7. IEEE, (2015)Thermo-mechanical characterization of passive stress sensors in Si interposer., , , , , , , , and . Microelectron. Reliab., 55 (5): 738-746 (2015)Fracture phenomena induced by Front-End/Back-End interactions: Dedicated failure analysis and numerical developments., , and . Microelectron. Reliab., 50 (1): 75-85 (2010)Thermal correlation between measurements and FEM simulations in 3D ICs., , , , , , , , , and 4 other author(s). 3DIC, page 1-6. IEEE, (2013)Qualification of bumping processes: Experimental and numerical investigations on mechanical stress and failure modes induced by shear test., , , , , , and . Microelectron. Reliab., 55 (6): 980-989 (2015)Wafer level measurements and numerical analysis of self-heating phenomena in nano-scale SOI MOSFETs., , , , and . Microelectron. Reliab., (2016)