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Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits.

P. Coudrain, P. Souare, R. Prieto, V. Fiori, A. Farcy, L. Pailleur, J. Colonna, C. Santos, P. Vivet, M. Jamaa, D. Dutoit, F. de Crecy, S. Dumas, C. Chancel, D. Lattard, and S. Cheramy. IEEE Des. Test, 33 (3): 21-36 (2016)

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Cristiano Pereira

Cristiano Bertolini

Cristiano Micheli

Cristiano Bettega

Cristiano Tonello

Other publications of authors with the same name

Objective and Subjective Video Quality Assessment in Mobile Devices for Low-Complexity H.264/AVC Codecs.M. Melo, J. Goebel, D. Farias, C. Santos, T. Tavares, G. Corrêa, B. Zatt, and M. Porto. WebMedia, page 429-432. ACM, (2017)Efficient timing closure with a transistor level design flow.C. Lazzari, C. Santos, A. Ziesemer, L. Anghel, and R. Reis. VLSI-SoC, page 312-315. IEEE, (2007)Incremental timing optimization for automatic layout generation.C. Santos, D. Ferrão, R. Reis, and J. Güntzel. ISCAS (4), page 3567-3570. IEEE, (2005)Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits.P. Coudrain, P. Souare, R. Prieto, V. Fiori, A. Farcy, L. Pailleur, J. Colonna, C. Santos, P. Vivet, M. Jamaa and 6 other author(s). IEEE Des. Test, 33 (3): 21-36 (2016)Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes.C. Santos, P. Vivet, S. Thuries, O. Billoint, J. Colonna, P. Coudrain, and L. Wang. 3DIC, page 1-5. IEEE, (2016)A Comparison of Layout Implementations of Pipelined and Non-Pipelined Signed Radix-4 Array Multiplier and Modified Booth Multiplier Architectures.L. de Oliveira, C. Santos, D. Ferrão, E. da Costa, J. Monteiro, J. dos Santos Martins, S. Bampi, and R. da Luz Reis. VLSI-SoC, volume 240 of IFIP, page 25-39. Springer, (2005)A New Transistor-Level Layout Generation Strategy for Static CMOS Circuits.C. Lazzari, C. Santos, and R. Reis. ICECS, page 660-663. IEEE, (2006)Graphite-based heat spreaders for hotspot mitigation in 3D ICs.C. Santos, R. Prieto, P. Vivet, J. Colonna, P. Coudrain, and R. Reis. 3DIC, page TS10.4.1-TS10.4.4. IEEE, (2015)Using TSVs for thermal mitigation in 3D circuits: Wish and truth.C. Santos, P. Souare, F. de Crecy, P. Coudrain, J. Colonna, P. Vivet, A. Borbely, R. Reis, M. Jamaa, V. Fiori and 1 other author(s). 3DIC, page 1-8. IEEE, (2014)Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells.M. Brocard, B. Mathieu, J. Colonna, C. Santos, C. Fenouillet-Béranger, C. Lu, G. Cibrario, L. Brunet, P. Batude, F. Andrieu and 2 other author(s). ISVLSI, page 539-544. IEEE Computer Society, (2017)

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Disambiguation of "Santos, Cristiano"

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Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits.

Please choose a person to relate this publication to

Cristiano Pereira

Cristiano Bertolini

Cristiano Micheli

Cristiano Bettega

Cristiano Tonello

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Santos, Cristiano"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits.

Please choose a person to relate this publication to

Cristiano Pereira

Cristiano Bertolini

Cristiano Micheli

Cristiano Bettega

Cristiano Tonello

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
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APA
Chicago
DIN 1505
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Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits.