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Disambiguation of "Chen, Rongmei"

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Single-event performance of differential flip-flop designs and hardening implication.

, , and . IOLTS, page 221-226. IEEE, (2016)

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Chen Chen

Chen Chen

Shih Chen Chen

Yi-Chen Chen

Chen-Loung Chen

 

Other publications of authors with the same name

Single-event multiple transients in guard-ring hardened inverter chains of different layout designs., , , , , , , , , and 1 other author(s). Microelectron. Reliab., (2018)Modeling the impact of well contacts on SEE response with bias-dependent Single-Event compact model., , , , , , , and . Microelectron. Reliab., (2018)Carbon Nanotube SRAM in 5-nm Technology Node Design, Optimization, and Performance Evaluation - Part II: CNT Interconnect Optimization., , , , , , , , , and 2 other author(s). IEEE Trans. Very Large Scale Integr. Syst., 30 (4): 440-448 (2022)Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited)., , , , , , and . SLIP, page 17-23. IEEE, (2021)Opportunities of Chip Power Integrity and Performance Improvement through Wafer Backside (BS) Connection: Invited Paper., , , , , , and . SLIP, page 3:1-3:5. ACM, (2022)Innovations in Transistor Architecture and Device Connectivity for Advanced Logic Scaling., , , , , , , and . ICICDT, page 51-54. IEEE, (2022)Improved on-chip self-triggered single-event transient measurement circuit design and applications., , , , , , , , , and 2 other author(s). Microelectron. Reliab., (2017)A Modeling Study: Applying Carbon-Based Interconnects to BS-PDN Architecture., , and . ASICON, page 1-4. IEEE, (2023)The Promise of 2-D Materials for Scaled Digital and Analog Applications., , , , , , , , , and 2 other author(s). ISSCC, page 394-395. IEEE, (2023)Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails., , , , , , , , , and 34 other author(s). VLSI Technology and Circuits, page 284-285. IEEE, (2022)