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Scaling CMOS beyond Si FinFET: an analog/RF perspective.

B. Parvais, G. Hellings, M. Simicic, P. Weckx, J. Mitard, D. Jang, V. Deshpande, B. van Liempc, A. Veloso, A. Vandooren, N. Waldron, P. Wambacq, N. Collaert, and D. Verkest. ESSDERC, page 158-161. IEEE, (2018)

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R. A. A. Bowler

Â°Ake Â°Akerström

Mohamed A A Anndif

Eltohamy A A Yousef

-A Venbrocks

Other publications of authors with the same name

Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies : Invited paper.J. Franco, H. Arimura, J. de Marneffe, A. Vandooren, L. Ragnarsson, Z. Wu, D. Claes, E. Litta, N. Horiguchi, K. Croes and 3 other author(s). ICICDT, page 1-4. IEEE, (2021)Demonstration of 3D sequential FD-SOI on CMOS FinFET stacking featuring low temperature Si layer transfer and top tier device fabrication with tier interconnections.A. Vandooren, N. Parihar, J. Franco, R. Loo, H. Arimura, R. Rodriguez, F. Sebaai, S. Iacovo, K. Vandersmissen, W. Li and 15 other author(s). VLSI Technology and Circuits, page 330-331. IEEE, (2022)Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling.A. Vandooren, L. Witters, J. Franco, A. Mallik, B. Parvais, Z. Wu, A. Walke, V. Deshpande, E. Rosseel, A. Hikavyy and 15 other author(s). ICICDT, page 145-148. IEEE, (2018)Reliability challenges in Forksheet Devices: (Invited Paper).E. Bury, M. Vandemaele, J. Franco, A. Chasin, S. Tyaginov, A. Vandooren, R. Ritzenthaler, H. Mertens, J. Diaz-Fortuny, N. Horiguchi and 2 other author(s). IRPS, page 1-8. IEEE, (2023)Scaling CMOS beyond Si FinFET: an analog/RF perspective.B. Parvais, G. Hellings, M. Simicic, P. Weckx, J. Mitard, D. Jang, V. Deshpande, B. van Liempc, A. Veloso, A. Vandooren and 4 other author(s). ESSDERC, page 158-161. IEEE, (2018)Molybdenum Nitride as a Scalable and Thermally Stable pWFM for CFET.H. Arimura, S. Brus, J. Franco, Y. Oniki, A. Vandooren, T. Conard, B. Chan, B. Kannan, M. Samiee, W. Li and 11 other author(s). VLSI Technology and Circuits, page 1-2. IEEE, (2023)Beyond-Si materials and devices for more Moore and more than Moore applications.N. Collaert, A. Alian, H. Arimura, G. Boccardi, G. Eneman, J. Franco, T. Ivanov, D. Lin, J. Mitard, S. Ramesh and 16 other author(s). ICICDT, page 1-5. IEEE, (2016)

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Disambiguation of "Vandooren, A."

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Scaling CMOS beyond Si FinFET: an analog/RF perspective.

Please choose a person to relate this publication to

R. A. A. Bowler

Â°Ake Â°Akerström

Mohamed A A Anndif

Eltohamy A A Yousef

-A Venbrocks

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Vandooren, A."

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Scaling CMOS beyond Si FinFET: an analog/RF perspective.

Please choose a person to relate this publication to

R. A. A. Bowler

Â°Ake Â°Akerström

Mohamed A A Anndif

Eltohamy A A Yousef

-A Venbrocks

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
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APA
Chicago
DIN 1505
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Scaling CMOS beyond Si FinFET: an analog/RF perspective.