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Design of non-contact 2Gb/s I/O test methods for high bandwidth memory (HBM)., , , , , , , , , and 9 other author(s). A-SSCC, page 169-172. IEEE, (2016)23.2 A 5Gb/s/pin 8Gb LPDDR4X SDRAM with power-isolated LVSTL and split-die architecture with 2-die ZQ calibration scheme., , , , , , , , , and 27 other author(s). ISSCC, page 390-391. IEEE, (2017)Design technologies for a 1.2V 2.4Gb/s/pin high capacity DDR4 SDRAM with TSVs., , , , , , , , , and 1 other author(s). VLSIC, page 1-2. IEEE, (2014)A 16Gb LPDDR4X SDRAM with an NBTI-tolerant circuit solution, an SWD PMOS GIDL reduction technique, an adaptive gear-down scheme and a metastable-free DQS aligner in a 10nm class DRAM process., , , , , , , , , and 37 other author(s). ISSCC, page 206-208. IEEE, (2018)Dynamic Bit-Width Adaptation in DCT: An Approach to Trade Off Image Quality and Computation Energy., , and . IEEE Trans. Very Large Scale Integr. Syst., 18 (5): 787-793 (2010)O2C: occasional two-cycle operations for dynamic thermal management in high performance in-order microprocessors., , , and . ISLPED, page 189-192. ACM, (2008)Dual-Loop Two-Step ZQ Calibration for Dynamic Voltage-Frequency Scaling in LPDDR4 SDRAM., , , , , , , , , and 13 other author(s). IEEE J. Solid State Circuits, 53 (10): 2906-2916 (2018)A 1.2 V 20 nm 307 GB/s HBM DRAM With At-Speed Wafer-Level IO Test Scheme and Adaptive Refresh Considering Temperature Distribution., , , , , , , , , and 9 other author(s). IEEE J. Solid State Circuits, 52 (1): 250-260 (2017)A 40 mV-Differential-Channel-Swing Transceiver Using a RX Current-Integrating TIA and a TX Pre-Emphasis Equalizer With a CML Driver at 9 Gb/s., , , , , , , , and . IEEE Trans. Circuits Syst. I Regul. Pap., 63-I (1): 122-133 (2016)A 4ns Settling Time FVF-Based Fast LDO Using Bandwidth Extension Techniques for HBM3., , , , , , , , , and 4 other author(s). A-SSCC, page 1-3. IEEE, (2023)