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Disambiguation of "Arnaud, Lucile"

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Towards high density 3D interconnections.

, , , , , and . 3DIC, page 1-5. IEEE, (2016)

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Lucile Graff

Lucile Tartivel

Lucile Sautot

Lucile Bechade

Lucile Callebert

 

Other publications of authors with the same name

Misalignment Analysis and Electrical Performance of High Density 3D-IC interconnects., , , , and . 3DIC, page 1-4. IEEE, (2019)Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric., , , , , , , , , and . Microelectron. Reliab., 53 (1): 17-29 (2013)2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters., , , , , , , , , and 18 other author(s). ISSCC, page 46-48. IEEE, (2020)Towards high density 3D interconnections., , , , , and . 3DIC, page 1-2. IEEE, (2016)IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management., , , , , , , , , and 18 other author(s). IEEE J. Solid State Circuits, 56 (1): 79-97 (2021)Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability., , , , , , , , , and 7 other author(s). IRPS, page 4. IEEE, (2018)Study of EM void nucleation and mechanic relaxation effects., , and . Microelectron. Reliab., 54 (9-10): 1692-1696 (2014)3D interconnection using copper direct hybrid bonding for GaN on silicon wafer., , , , , , , and . 3DIC, page 1-4. IEEE, (2021)Interconnect design study for electromigration reliability improvement., , , and . IRPS, page 2. IEEE, (2015)Apocalypse Dog., , , , , , , and . SIGGRAPH Asia Computer Animation Festival, page 9:1. ACM, (2022)