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Adaptive Service in Mobile Computing Environments, , и . Proc. of the International Workshop on Quality of Service (IWQoS), стр. 25--36. New York, USA, (мая 1997)Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV., , , , , , , и . 3DIC, стр. 1-4. IEEE, (2014)Fall detection algorithm for the elderly using acceleration sensors on the shoes., , , , , , и . EMBC, стр. 4935-4938. IEEE, (2011)Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI., , , , , , , и . 3DIC, стр. 1-4. IEEE, (2014)Development and Product Reliability Characterization of Advanced High Speed 14nm DDR5 DRAM with On-die ECC., , , , , , , , и . IRPS, стр. 1-4. IEEE, (2023)Optimal Sizing of Feedforward Neural Networks: Case Studies., и . ANNES, стр. 79-82. IEEE Computer Society, (1995)Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study., , , , , , и . 3DIC, стр. TS8.10.1-TS8.10.5. IEEE, (2015)Robot Space Exploration Using Peano Paths Generated by Self-Organizing Maps., , и . ICARCV, стр. 1-6. IEEE, (2006)Roadmap constrained SLAM in neighborhood environment., , и . ICARCV, стр. 449-454. IEEE, (2004)Optimising neural network weights using genetic algorithms: a case study., и . ICNN, стр. 1384-1388. IEEE, (1995)