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Disambiguation of "Jin, Gyo-Young"

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23.4 An extremely low-standby-power 3.733Gb/s/pin 2Gb LPDDR4 SDRAM for wearable devices.

, , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , and . ISSCC, page 394-395. IEEE, (2017)

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Jin Young Kim

Jin-Young Bae

Young-Jin Maeng

Young-Jin Choi

Young-Jin Kim

 

Other publications of authors with the same name

Design of non-contact 2Gb/s I/O test methods for high bandwidth memory (HBM)., , , , , , , , , and 9 other author(s). A-SSCC, page 169-172. IEEE, (2016)23.2 A 5Gb/s/pin 8Gb LPDDR4X SDRAM with power-isolated LVSTL and split-die architecture with 2-die ZQ calibration scheme., , , , , , , , , and 27 other author(s). ISSCC, page 390-391. IEEE, (2017)Defect Analysis and Cost-Effective Resilience Architecture for Future DRAM Devices., , , , , , , , , and 2 other author(s). HPCA, page 61-72. IEEE Computer Society, (2017)The classification methodology of chip quality using canonical correlation analysis-based variable selection on chip level data., , , , , and . IEEM, page 381-385. IEEE, (2015)18.2 A 1.2V 20nm 307GB/s HBM DRAM with at-speed wafer-level I/O test scheme and adaptive refresh considering temperature distribution., , , , , , , , , and 11 other author(s). ISSCC, page 316-317. IEEE, (2016)A 6.4Gb/s/pin at sub-1V supply voltage TX-interleaving technique for mobile DRAM interface., , , , , , , , , and 6 other author(s). VLSIC, page 182-. IEEE, (2015)Novel Deep Trench Buried-Body-Contact (DBBC) of 4F2 cell for sub 30nm DRAM technology., , , , , , , , , and 2 other author(s). ESSDERC, page 193-196. IEEE, (2012)A 31 ns Random Cycle VCAT-Based 4F 2 DRAM With Manufacturability and Enhanced Cell Efficiency., , , , , , , , , and 11 other author(s). IEEE J. Solid State Circuits, 45 (4): 880-888 (2010)23.4 An extremely low-standby-power 3.733Gb/s/pin 2Gb LPDDR4 SDRAM for wearable devices., , , , , , , , , and 26 other author(s). ISSCC, page 394-395. IEEE, (2017)18.1 A 20nm 9Gb/s/pin 8Gb GDDR5 DRAM with an NBTI monitor, jitter reduction techniques and improved power distribution., , , , , , , , , and 7 other author(s). ISSCC, page 314-315. IEEE, (2016)