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A reconfigurable test method based on LFSR for 3D stacking integrated circuits.

C. Tian, J. Lu, L. Jun, H. Liang, Y. Lu, and M. Yi. Integr., (2022)

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Huaguo Liang

Liang Liang

Liang-Liang Fu

Qian Liang

Tzan Jing Liang

Other publications of authors with the same name

Architecting a congestion pre-avoidance and load-balanced wireless network-on-chip.C. Sun, Y. Ouyang, and H. Liang. J. Parallel Distributed Comput., (2022)Reliability analysis and comparison of ring-PUF based on probabilistic models.J. Bian, Z. Huang, Y. Lin, Z. Yang, H. Liang, and T. Ni. Microelectron. J., (February 2024)A reconfigurable PUF structure with dual working modes based on entropy separation model.Y. Wang, H. Liang, Y. Wang, L. Yao, M. Yi, Z. Huang, and Y. Lu. Microelectron. J., (2022)Design of MNU-Resilient latches based on input-split C-elements.Z. Huang, X. Li, Z. Gong, H. Liang, Y. Lu, Y. Ouyang, and T. Ni. Microelectron. J., (2021)CPCA: An efficient wireless routing algorithm in WiNoC for cross path congestion awareness.Y. Ouyang, Z. Li, J. Li, C. Sun, H. Liang, and G. Du. Integr., (2019)Balancing wrapper chains of SoC core based on best interchange decreasing.M. Yi, H. Liang, and Z. Huang. SoC, page 1-4. IEEE, (2008)Dual-Interlocked-Storage-Cell-Based Double-Node-Upset Self-Recoverable Flip-Flop Design for Safety-Critical Applications.A. Yan, Z. Xu, J. Cui, Z. Ying, Z. Huang, H. Liang, P. Girard, and X. Wen. ISCAS, page 1-5. IEEE, (2020)A Pulse Shrinking-Based Test Solution for Prebond Through Silicon via in 3-D ICs.M. Yi, J. Bian, T. Ni, C. Jiang, H. Chang, and H. Liang. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 38 (4): 755-766 (2019)LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults.T. Ni, Y. Yao, H. Chang, L. Lu, H. Liang, A. Yan, Z. Huang, and X. Wen. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 39 (10): 2938-2951 (2020)A Self-Biased Current Reference Source-Based Pre-Bond TSV Test Solution.J. Liu, S. Cheng, T. Chen, X. Wu, and H. Liang. IEEE Trans. Very Large Scale Integr. Syst., 32 (4): 774-781 (April 2024)

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Disambiguation of "Liang, Huaguo"

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A reconfigurable test method based on LFSR for 3D stacking integrated circuits.

Please choose a person to relate this publication to

Huaguo Liang

Liang Liang

Liang-Liang Fu

Qian Liang

Tzan Jing Liang

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Liang, Huaguo"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML A reconfigurable test method based on LFSR for 3D stacking integrated circuits.

Please choose a person to relate this publication to

Huaguo Liang

Liang Liang

Liang-Liang Fu

Qian Liang

Tzan Jing Liang

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

A reconfigurable test method based on LFSR for 3D stacking integrated circuits.