( en | de | ru )

 

Disambiguation of "Sakuma, Katsuyuki"

Author of the publication

copydeleteadd this publication to your clipboard
Turning the Finger into a Writing Tool.

, , , , and . EMBC, page 1239-1242. IEEE, (2019)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Hidenori Sakuma

Hironobu Sakuma

Yasuhiko Sakuma

Yasuhiko Sakuma

 

Other publications of authors with the same name

Three-dimensional silicon integration., , , , , , , , , and 6 other author(s). IBM J. Res. Dev., 52 (6): 553-569 (2008)Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration., , , , , , , , and . 3DIC, page 1-7. IEEE, (2011)Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack., , , , , , , , , and 1 other author(s). 3DIC, page 1-8. IEEE, (2013)Turning the Finger into a Writing Tool., , , , and . EMBC, page 1239-1242. IEEE, (2019)Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack., , , and . 3DIC, page 1-5. IEEE, (2009)3D chip stacking with C4 technology., , , , , , , , , and 4 other author(s). IBM J. Res. Dev., 52 (6): 599-609 (2008)10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack., , , , , , , , , and . 3DIC, page 1-6. IEEE, (2009)Chip-level TSV integration for rapid prototyping of 3D system LSIs., , , , , , , , and . 3DIC, page 1-4. IEEE, (2011)Future system-on-silicon LSI chips., , , , , and . IEEE Micro, 18 (4): 17-22 (1998)High density 3D integration by pre-applied Inter Chip Fill., , , , , , , , and . 3DIC, page 1-5. IEEE, (2010)