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Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University.

, , , , and . 3DIC, page FS2.1-FS2.5. IEEE, (2015)

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Optimal Sizing of Feedforward Neural Networks: Case Studies., and . ANNES, page 79-82. IEEE Computer Society, (1995)Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study., , , , , , and . 3DIC, page TS8.10.1-TS8.10.5. IEEE, (2015)Fall detection algorithm for the elderly using acceleration sensors on the shoes., , , , , , and . EMBC, page 4935-4938. IEEE, (2011)Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI., , , , , , , and . 3DIC, page 1-4. IEEE, (2014)Development and Product Reliability Characterization of Advanced High Speed 14nm DDR5 DRAM with On-die ECC., , , , , , , , and . IRPS, page 1-4. IEEE, (2023)Adaptive Service in Mobile Computing Environments, , and . Proc. of the International Workshop on Quality of Service (IWQoS), page 25--36. New York, USA, (May 1997)Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV., , , , , , , and . 3DIC, page 1-4. IEEE, (2014)Robot Space Exploration Using Peano Paths Generated by Self-Organizing Maps., , and . ICARCV, page 1-6. IEEE, (2006)Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University., , , , and . 3DIC, page FS2.1-FS2.5. IEEE, (2015)Advances in biological structure, function, and physiology using synchrotron X-ray imaging*, , and . Annu Rev Physiol, (2008)