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Impact of data serialization over TSVs on routing congestion in 3D-stacked multi-core processors., , , and . Microelectron. J., (2016)A 60-Gb/s 1.9-pJ/bit NRZ Optical Receiver With Low-Latency Digital CDR in 14-nm CMOS FinFET., , , , , , , , , and 7 other author(s). IEEE J. Solid State Circuits, 53 (4): 1227-1237 (2018)A 64-Gb/s 1.4-pJ/b NRZ Optical Receiver Data-Path in 14-nm CMOS FinFET., , , , , , , , , and 7 other author(s). IEEE J. Solid State Circuits, 52 (12): 3458-3473 (2017)A 161mW 56Gb/s ADC-Based Discrete Multitone Wireline Receiver Data-Path in 14nm FinFET., , , , , , , , , and 5 other author(s). ISSCC, page 476-478. IEEE, (2019)Background calibration using noisy reference ADC for a 12 b 600 MS/s 2 × TI SAR ADC in 14nm CMOS FinFET., , , , , , , , , and 2 other author(s). ESSCIRC, page 183-186. IEEE, (2017)A 12-bit 300-MS/s SAR ADC With Inverter-Based Preamplifier and Common-Mode-Regulation DAC in 14-nm CMOS FinFET., , , , , , , , , and 2 other author(s). IEEE J. Solid State Circuits, 53 (11): 3268-3279 (2018)Design space exploration for field programmable compressor trees., , , , , , and . CASES, page 207-216. ACM, (2008)Design and analysis of jitter-aware low-power and high-speed TSV link for 3D ICs., , , , and . Microelectron. J., (2016)3D serial TSV link for low-power chip-to-chip communication., , , and . ICICDT, page 1-4. IEEE, (2014)A 100Gb/s 1.1pJ/b PAM-4 RX with Dual-Mode 1-Tap PAM-4 / 3-Tap NRZ Speculative DFE in 14nm CMOS FinFET., , , , , , , , , and 1 other author(s). ISSCC, page 112-114. IEEE, (2019)