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Persistent xSPI STT-MRAM with up to 400MB/s Read and Write Throughput.

S. Alam, D. Houssameddine, F. Neumeyer, I. Rahman, M. DeHerrera, S. Ikegawa, P. Sanchez, X. Zhang, Y. Wang, J. Williams, D. Gogl, H. Xu, M. Farook, D. Aceves, H. Lee, F. Mancoff, M. Chou, C. Tan, B. Huang, S. Mukherjee, M. Lu, A. Shah, K. Nagel, Y. Kim, and S. Aggarwal. IMW, page 1-4. IEEE, (2022)

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Masoom Alam

Renate Syed

Adnan Shahzad Syed

Homayun Alam

Fakhrul Alam

Other publications of authors with the same name

STT-Based Non-Volatile Logic-in-Memory Framework.J. Das, S. Alam, and S. Bhanja. Field-Coupled Nanocomputing, volume 8280 of Lecture Notes in Computer Science, Springer, (2014)Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies.N. Khan, S. Alam, and S. Hassoun. IEEE Trans. Very Large Scale Integr. Syst., 19 (4): 647-658 (2011)Design tool and methodologies for interconnect reliability analysis in integrated circuits.S. Alam. Massachusetts Institute of Technology, Cambridge, MA, USA, (2004)ndltd.org (oai:dspace.mit.edu:1721.1/26722).Circuit Level Reliability Analysis of Cu Interconnects.S. Alam, C. Gan, C. Thompson, and D. Troxel. ISQED, page 238-243. IEEE Computer Society, (2004)Ultra-Low Power Hybrid CMOS-Magnetic Logic Architecture.J. Das, S. Alam, and S. Bhanja. IEEE Trans. Circuits Syst. I Regul. Pap., 59-I (9): 2008-2016 (2012)Thermal-electrical co-optimisation of floorplanning of three-dimensional integrated circuits under manufacturing and physical design constraints.A. Jain, S. Alam, S. Pozder, and R. Jones. IET Comput. Digit. Tech., 5 (3): 169-178 (2011)Adiabatic/MTJ-Based Physically Unclonable Function for Consumer Electronics Security.Z. Kahleifeh, H. Thapliyal, and S. Alam. IEEE Trans. Consumer Electron., 69 (1): 1-8 (February 2023)Mitigating TSV-induced substrate noise in 3-D ICs using GND plugs.N. Khan, S. Alam, and S. Hassoun. ISQED, page 751-756. IEEE, (2011)Persistent xSPI STT-MRAM with up to 400MB/s Read and Write Throughput.S. Alam, D. Houssameddine, F. Neumeyer, I. Rahman, M. DeHerrera, S. Ikegawa, P. Sanchez, X. Zhang, Y. Wang, J. Williams and 15 other author(s). IMW, page 1-4. IEEE, (2022)Through-Silicon Via (TSV)-induced noise characterization and noise mitigation using coaxial TSVs.N. Khan, S. Alam, and S. Hassoun. 3DIC, page 1-7. IEEE, (2009)

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Disambiguation of "Alam, Syed M."

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Persistent xSPI STT-MRAM with up to 400MB/s Read and Write Throughput.

Please choose a person to relate this publication to

Masoom Alam

Renate Syed

Adnan Shahzad Syed

Homayun Alam

Fakhrul Alam

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Alam, Syed M."

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Persistent xSPI STT-MRAM with up to 400MB/s Read and Write Throughput.

Please choose a person to relate this publication to

Masoom Alam

Renate Syed

Adnan Shahzad Syed

Homayun Alam

Fakhrul Alam

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Persistent xSPI STT-MRAM with up to 400MB/s Read and Write Throughput.