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X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm., , , , , и . Microelectron. Reliab., (2016)Microscopic Three-Dimensional Measurement Based on Telecentric Stereo and Speckle Projection Methods., , , , и . Sensors, 18 (11): 3882 (2018)Metal-catalyst free integration of SiO2 nanowires into carbon MEMS., , , , , и . NEMS, стр. 734-737. IEEE, (2013)Numerical and experimental study of Microscale Laser Shock Processing using excimer laser., , , , , и . NEMS, стр. 265-269. IEEE Computer Society, (2009)Defect detection of flip-chip solder joints using modal analysis., , , , и . Microelectron. Reliab., 52 (12): 3002-3010 (2012)Improved adhesion between C-MEMS and substrate by micromechanical interlocking., , , , , и . NEMS, стр. 624-627. IEEE Computer Society, (2009)Low temperature direct bonding for hermetic wafer level packaging., , , , и . NEMS, стр. 472-475. IEEE Computer Society, (2009)Fabrication of biomimetic gecko setae by direct photolithography and micromolding processes., , , и . NEMS, стр. 503-506. IEEE, (2011)Optimal design of periodic nanostructures formed in solar cells as an antireflective layer., , , , , и . NEMS, стр. 524-527. IEEE, (2013)Using SOM neural network for X-ray inspection of missing-bump defects in three-dimensional integration., , , , , , и . Microelectron. Reliab., 55 (12): 2826-2832 (2015)