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Long Term NBTI Relaxation Under AC and DC Biased Stress and Recovery., , , и . IRPS, стр. 1-5. IEEE, (2019)Transformation of Ramped Current Stress VBDto Constant Voltage Stress TDDB TBD., , , и . IRPS, стр. 1-5. IEEE, (2019)Improving and optimizing reliability in future technologies with high-κ dielectrics., , , и . VLSI-DAT, стр. 1-4. IEEE, (2013)Electromigration characteristics of power grid like structures., , , , и . IRPS, стр. 4. IEEE, (2018)Analysis of the effect of the gate oxide breakdown on SRAM stability., , , , , , , , , и . Microelectron. Reliab., 42 (9-11): 1445-1448 (2002)Influence and model of gate oxide breakdown on CMOS inverters., , , , и . Microelectron. Reliab., 43 (9-11): 1439-1444 (2003)Dependence of Post-Breakdown Conduction on Gate Oxide Thickness., , и . Microelectron. Reliab., 42 (9-11): 1481-1484 (2002)A Flexible and Inherently Self-Consistent Methodology for MOL/BEOL/MIMCAP TDDB Applications with Excessive Variability-Induced Degradation., , , , , , , и . IRPS, стр. 2. IEEE, (2022)Analyzing path delays for accelerated testing of logic chips., , , , , , , и . IRPS, стр. 6. IEEE, (2015)Circuit implications of gate oxide breakdown., , и . Microelectron. Reliab., 43 (8): 1193-1197 (2003)