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On the impact of buffer and GaN-channel thickness on current dispersion for GaN-on-Si RF/mmWave devices., , , , , , , , and . IRPS, page 1-8. IEEE, (2021)Exploring the DC reliability metrics for scaled GaN-on-Si devices targeted for RF/5G applications., , , , , , , , , and 3 other author(s). IRPS, page 1-8. IEEE, (2020)Design of a 28 GHz differential GaAs power amplifier with capacitive neutralization for 5G mmwave applications., , , , , , , and . NEWCAS, page 1-4. IEEE, (2019)Scaling CMOS beyond Si FinFET: an analog/RF perspective., , , , , , , , , and 4 other author(s). ESSDERC, page 158-161. IEEE, (2018)A defect characterization technique for the sidewall surface of Nano-ridge and Nanowire based Logic and RF technologies., , , , , , , , , and 1 other author(s). IRPS, page 1-5. IEEE, (2021)Beyond-Si materials and devices for more Moore and more than Moore applications., , , , , , , , , and 16 other author(s). ICICDT, page 1-5. IEEE, (2016)Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling., , , , , , , , , and 15 other author(s). ICICDT, page 145-148. IEEE, (2018)