( en | de | ru )

 

Disambiguation of "Swinnen, Bart"

Author of the publication

copydeleteadd this publication to your clipboard
Impact of 3D design choices on manufacturing cost.

, , , , and . 3DIC, page 1-5. IEEE, (2009)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Bart Maris

Bart Cramer

Bart Kersbergen

Bart Riel

Bart Geurts

 

Other publications of authors with the same name

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding., , , , , , , , , and 6 other author(s). 3DIC, page 1-4. IEEE, (2011)Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads., , and . Microelectron. Reliab., 46 (8): 1315-1325 (2006)Impact of 3D design choices on manufacturing cost., , , , and . 3DIC, page 1-5. IEEE, (2009)300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications., , , , , , , , , and . 3DIC, page 1-4. IEEE, (2010)In-line metrology and inspection for process control during 3D stacking of IC's., , , , , , , and . 3DIC, page 1-4. IEEE, (2011)3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps., , , , , , , , , and 9 other author(s). ICICDT, page 1-4. IEEE, (2012)Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures., , , , , and . Microelectron. Reliab., 48 (8-9): 1517-1520 (2008)3-D Technology Assessment: Path-Finding the Technology/Design Sweet-Spot., , , , , , , , and . Proc. IEEE, 97 (1): 96-107 (2009)3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV)., , , , , , , , , and 3 other author(s). 3DIC, page 1-5. IEEE, (2009)Diving into the subcortex: The potential of chronic subcortical sensing for unravelling basal ganglia function and optimization of deep brain stimulation., , , , and . NeuroImage, (2022)