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Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration.

, , , , , , , , , , , и . 3DIC, стр. 1-7. IEEE, (2013)

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Alexis Rozenknop

Alexis Hoen

Alexis Lebedeff

Alexis Rump

Alexis Gette

 

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